- Country: USA
- Summary: 4H-SiC Silicon Carbide (SiC) Integrated Circuit Processing on 100 mm Diameter SiC Wafers
- UST Ref No: 121730836
- Deadline: 28 Jul 2025
- Financier: Self Financed
- Purchaser Ownership: Government
- Tender Value: Refer Document
- Notice Type: Tender
- Document Ref. No.: 80GRC025R7016_RFP
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- Description:
- Description
You are invited to submit a proposal in response to the National Aeronautics and Space Administration (NASA) Glenn Research Center-s Fabrication of 4H-SiC Silicon Carbide (SiC) Integrated Circuit Processing on 100 mm Diameter SiC Wafers solicitation. The principal purpose of this requirement is to provide an integrated silicon carbide (SiC) device structures, specifically JFETs and resistors, on NASA-supplied 100 mm 4H-SiC wafers, following the “Gen. 12b” process flow and using NASA-provided design files.
NASA will conduct this acquisition as a full and open competition. The North American Industry Classification System (NAICS) code for this acquisition is 541715, with a small business size standard of 1,000 employees.
This competitive acquisition will result in a firm-fixed price (FFP) contract. The anticipated period of performance (PoP) for this effort is award plus 5-months.
In accordance with FAR provision 52.204-7, potential offerors intending to submit proposals must be registered in the System for Award Management (SAM) at https://www.sam.gov/SAM/.
Enclosed is the Request for Proposal (RFP) for the subject procurement. Please carefully review Sections L - “INSTRUCTIONS, CONDITIONS, AND NOTICES TO OFFERORS” and Section M - “EVALUATION FACTORS FOR AWARD,” which describes the process for contractor evaluation and selection. Offerors are encouraged to refer to Federal Acquisition Regulation (FAR) provision 52.215-1, INSTRUCTIONS TO OFFERORS-COMPETITIVE ACQUISITION, in particular paragraph (f)(4) which discusses the Government-s right to award a contract without discussions.
To control and protect sensitive data owned by the Government and its Contractors, NASA policy requires all acquisition-related documents be released in Adobe Portable Document Format (PDF).
Documents related to this acquisition, including this letter, the solicitation, attachments, exhibits, any amendments, and links to online reference/technical/bidde... - Documents:
Attachment-A-4H-SiC-Silicon-Carbide-SiC-Integr.pdf
Attachment-B-Fixed-Price-Template_For-RFP.xlsx
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CLICK HERE TO LOGIN4H-SiC Silicon Carbide (SiC) Integrated Circuit Processing on 100 mm Diameter SiC Wafers - USA Tender
The NATIONAL AERONAUTICS AND SPACE ADMINISTRATION, a Government sector organization in USA, has announced a new tender for 4H-SiC Silicon Carbide (SiC) Integrated Circuit Processing on 100 mm Diameter SiC Wafers. This tender is published on USARFP under UST Ref No: 121730836 and is categorized as a Tender. Interested and eligible suppliers are invited to participate by reviewing the tender documents and submitting their bids before the deadline on 2025-07-28.
The estimated tender value is Refer Document, and full details, including technical specifications and submission requirements, are provided in the official tender documents. Ensure all submissions meet the criteria outlined to be considered for evaluation.
