- Country: USA
- Summary: CHIPS RD Extreme Thermal Cycling Chamber Combined Sources SoughtNotice of Intent to Sole Source
- UST Ref No: 132010487
- Deadline: 26 Dec 2025
- Financier: Self Financed
- Purchaser Ownership: Government
- Tender Value: Refer Document
- Notice Type: Tender
- Document Ref. No.: NIST-SS26-CHIPS-49
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- Description:
- ***THIS IS A COMBINED SOURCES SOUGHT NOTICE AND NOTICE OF INTENT TO SOLE SOURCE***
The National Institute of Standards and Technology (NIST) Infrastructure and Materials Group within the Engineering Laboratory is seeking an Extreme Thermal Cycling Chamber to perform accelerated aging experiments using rapid thermal cycling as part of a study of long-term reliability of materials used in advanced packaging of semiconductor chips. This work is in support of the CHIPS Metrology program.
The CHIPS Metrology program develops and advances cutting edge metrology capabilities for members of the US semiconductor manufacturing ecosystem. This NIST conducted research program works with device manufacturers, tool vendors, materials suppliers, and other organizations to address critical metrology gaps to spur innovation within seven grand challenge areas. For more information on CHIPS Metrology, please visit https://www.nist.gov/chips/research-development-programs/metrology-program.
The Infrastructure and Materials Group requires the acquisition of a rapid thermal cycling instrument (-100 °C to 200 °C, 70 °C/min). This rapid thermal cycling instrument is essential to our CHIPS project focused on reliability of advanced packaging in heterogeneously integrated semiconductor devices. This capability directly supports the CHIPS R&D Metrology Program-s Grand Challenge to enable metrology for integrating components in advanced packaging. By providing the semiconductor industry with an accurate material property database of polymeric packaging components throughout long-term aging and a new, more accurate reliability model, long-term reliability design efficiency (both time and cost savings) will be greatly improved.
This rapid thermal cycling instrument will allow for accelerated aging at variable ramp rate to study the effect of thermal environment, including direct in-situ temperature and resistance monitoring throughout samples, of polymeric components (e.g., underfills... - Documents:
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CLICK HERE TO LOGINCHIPS RD Extreme Thermal Cycling Chamber Combined Sources SoughtNotice of Intent to Sole Source - USA Tender
The COMMERCE, DEPARTMENT OF | NATIONAL INSTITUTE OF STANDARDS AND TECHNOLOGY, a Government sector organization in USA, has announced a new tender for CHIPS RD Extreme Thermal Cycling Chamber Combined Sources SoughtNotice of Intent to Sole Source. This tender is published on USARFP under UST Ref No: 132010487 and is categorized as a Tender. Interested and eligible suppliers are invited to participate by reviewing the tender documents and submitting their bids before the deadline on 2025-12-26.
The estimated tender value is Refer Document, and full details, including technical specifications and submission requirements, are provided in the official tender documents. Ensure all submissions meet the criteria outlined to be considered for evaluation.
