Tender Details

Country: USA
Summary: Large-Area Photocathodes (LAP) Proposers Day
UST Ref No: 107958483
Deadline: 11 Oct 2024
Financier: Self Financed
Purchaser Ownership: Government
Tender Value: Refer Document
Notice Type: Tender
Document Ref. No.: DARPA-SN-24-112
Purchaser's Detail:
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Description:
Description
PROPOSERS DAY:DARPA will host a Proposers Day in support of DARPA-PS-25-01, LAP program on October 22, 2024, at 4121 Wilson Boulevard, Arlington, VA 22003, and via Microsoft Teams Meeting from 9:00 AM to 5:00 PM. This conference aims to provide information on the LAP program; promote additional discussion on this topic; address questions from potential proposers; and provide a forum for potential proposers to present their capabilities for teaming opportunities. PROGRAM OBJECTIVE AND DESCRIPTION: The objective of the Large-Area Photocathodes (LAP) program is to develop large-area photocathodes suitable for high-power microwave (HPM) transmission systems. Photocathodes can be found in photomultiplier tubes, image intensifiers, and even free electron lasers. Photocathode materials can also be used in high-power electronics. Low-work function metals or semiconductors are typically applied in sub-micron thicknesses on planar millimeter to centimeter-scale areas.LAP seeks manufacturable photocathode material systems with high quantum efficiency that can be produced in large areas with substantial lifetimes and manageable handling requirements. LAP will develop and produce photocathodes that the government team will incorporate into a subscale high-power microwave transmitter prototype system.
Documents:

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Large-Area Photocathodes (LAP) Proposers Day - USA Tender

The DEPT OF DEFENSE | DEFENSE ADVANCED RESEARCH PROJECTS AGENCY (DARPA), a Government sector organization in USA, has announced a new tender for Large-Area Photocathodes (LAP) Proposers Day. This tender is published on USARFP under UST Ref No: 107958483 and is categorized as a Tender. Interested and eligible suppliers are invited to participate by reviewing the tender documents and submitting their bids before the deadline on 2024-10-11.

The estimated tender value is Refer Document, and full details, including technical specifications and submission requirements, are provided in the official tender documents. Ensure all submissions meet the criteria outlined to be considered for evaluation.