Tender Details

Country: USA
Summary: Micro specimens of thin film electroplated copper and micro-sized lead-free solder for mechanical testing to fracture
UST Ref No: 115196121
Deadline: 14 Mar 2025
Financier: Self Financed
Purchaser Ownership: Government
Tender Value: Refer Document
Notice Type: Tender
Document Ref. No.: NIST-SS25-21
Purchaser's Detail:
Login to see full purchaser details. Login to see full purchaser details. Login to see full purchaser details. Login to see full purchaser details. Login to see full purchaser details. Login to see full purchaser details. Login to see full purchaser details. Login to see full purchaser details. Login to see full purchaser details.
Login to see details
Description:
Description
NIST-SS25-21
PLEASE NOTE THIS A SOURCES SOUGHT NOTICE ONLY
Title: Micro specimens of thin film electroplated copper and micro-sized lead-free solder for mechanical testing to fracture.
BACKGROUND
The Applied Chemicals and Materials Division, in the Material Measurement Laboratory at NIST, is developing new metrology to measure the micromechanical properties, to fracture, of thin-film electroplated copper (Cu) and micro-sized lead-free solder. These materials are critical as interconnects for heterogeneous integration for advanced packaging. Cu is used for Cu-to-Cu hybrid bonding, the most advanced interconnect technology today and in the near future, while Sn-Ag-Cu (SAC) solder is used for all levels of packaging. The packaging industry relies on physics-based models and finite element models to predict the thermomechanical performance of these interconnects as well as to guide their design and process development and understand reliability-related issues. Such models require accurate material property data as inputs. Mechanical property data, to fracture, are lacking or sparse for these materials with size scales, chemical composition and microstructure similar to that of the interconnects. The characteristic length for Cu hybrid bonds is 1 micron, and that of solder can range from 1 micron to over 100 microns. Common practice is to use material property data measured from samples of Cu and/or solder that are dissimilar in size scales and/or with dissimilar microstructures from those used in Cu hybrid bonding and solder bumping, but such data is not accurate due to the effects of size, processing and microstructure on the properties. A state-of-the-art technique is to use nanoindentation to measure mechanical properties, however, nanoindentation tests are typically not to fracture, especially for ductile materials such as metals. NIST is therefore developing new measurement tools and techniques to measure various mechanical propertie...
Documents:

If you are registered member, kindly login to view full details of this tender notice:

Micro specimens of thin film electroplated copper and micro-sized lead-free solder for mechanical testing to fracture - USA Tender

The COMMERCE, DEPARTMENT OF | NATIONAL INSTITUTE OF STANDARDS AND TECHNOLOGY, a Government sector organization in USA, has announced a new tender for Micro specimens of thin film electroplated copper and micro-sized lead-free solder for mechanical testing to fracture. This tender is published on USARFP under UST Ref No: 115196121 and is categorized as a Tender. Interested and eligible suppliers are invited to participate by reviewing the tender documents and submitting their bids before the deadline on 2025-03-14.

The estimated tender value is Refer Document, and full details, including technical specifications and submission requirements, are provided in the official tender documents. Ensure all submissions meet the criteria outlined to be considered for evaluation.