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Tender Details
- Country: USA
- Summary: Next-Generation Microelectronics Manufacturing (Ngmm) Phase 1 and Phase 2
- UST Ref No: 92481766
- Deadline: 20 Feb 2024
- Competition: ICB
- Financier: Self Financed
- Purchaser Ownership: Public
- Tender Value: Refer Document
- Notice Type: Tender
- Document Ref. No.: DARPA-PA-24-03
- Purchaser's Detail :
- Description :
- Description
The NGMM program will advance the state of the art in three-dimensional heterogeneously integrated (3DHI) microelectronics through the formation of a domestic open-access prototyping and pilot line capability. This announcement solicits proposals for Phases 1 and 2 of the NGMM program. Phase 1 will focus on procuring and installing equipment, establishing baseline fabrication processes, developing a 3D assembly design kit (3D-ADK), and design automation and simulation software tailored to 3DHI. Phase 2 will build on Phase 1 to create hardware prototypes, automate processes, and develop emulation capabilities. The end goal of the program is to establish a self-sustaining 3DHI manufacturing center at an existing facility that is owned and operated by a non-federal entity and accessible to users in academia, government, and industry. Success will be measured by the ability to produce high-performance 3DHI microsystems at reasonable cost, with cycle times supporting fast-paced innovative research. - Documents :
Purchaser : DEPT OF DEFENSE
Contracting Office Address : ARLINGTON , VA 222032114
Primary Point of Contact : Dr. Dev Palmer
DARPA-PA-24-03@darpa.mil
Email :darpa-pa-24-03@darpa.mil
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