Next-Generation Microelectronics Manufacturing (Ngmm) Phase 1 and Phase 2

USARFP notice for Next-Generation Microelectronics Manufacturing (Ngmm) Phase 1 and Phase 2. The reference ID of the tender is 92481766 and it is closing on 20 Feb 2024.

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Tender Details

  • Country: USA
  • Summary: Next-Generation Microelectronics Manufacturing (Ngmm) Phase 1 and Phase 2
  • UST Ref No: 92481766
  • Deadline: 20 Feb 2024
  • Competition: ICB
  • Financier: Self Financed
  • Purchaser Ownership: Public
  • Tender Value: Refer Document
  • Notice Type: Tender
  • Document Ref. No.: DARPA-PA-24-03
  • Purchaser's Detail :
  • Purchaser : DEPT OF DEFENSE
    Contracting Office Address : ARLINGTON , VA 222032114
    Primary Point of Contact : Dr. Dev Palmer


  • Description :
  • Description
    The NGMM program will advance the state of the art in three-dimensional heterogeneously integrated (3DHI) microelectronics through the formation of a domestic open-access prototyping and pilot line capability. This announcement solicits proposals for Phases 1 and 2 of the NGMM program. Phase 1 will focus on procuring and installing equipment, establishing baseline fabrication processes, developing a 3D assembly design kit (3D-ADK), and design automation and simulation software tailored to 3DHI. Phase 2 will build on Phase 1 to create hardware prototypes, automate processes, and develop emulation capabilities. The end goal of the program is to establish a self-sustaining 3DHI manufacturing center at an existing facility that is owned and operated by a non-federal entity and accessible to users in academia, government, and industry. Success will be measured by the ability to produce high-performance 3DHI microsystems at reasonable cost, with cycle times supporting fast-paced innovative research.
  • Documents :
  •  Tender Notice

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