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Next-Generation Microelectronics Manufacturing (NGMM) Summit

USARFP notice for Next-Generation Microelectronics Manufacturing (NGMM) Summit. The reference ID of the tender is 122685195 and it is closing on 06 Oct 2025.

Tender Details

  • Country: USA
  • Summary: Next-Generation Microelectronics Manufacturing (NGMM) Summit
  • UST Ref No: 122685195
  • Deadline: 06 Oct 2025
  • Financier: Self Financed
  • Purchaser Ownership: Government
  • Tender Value: Refer Document
  • Notice Type: Tender
  • Document Ref. No.: DARPA-SN-25-85
  • Purchaser's Detail:
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  • Description:
  • Description
    The Defense Advanced Research Projects Agency (DARPA) will host the first annual Next-Generation Microelectronics Manufacturing Summit (NGMM) to convene stakeholders from across defense, academia, and industry to learn more about the program and how they can utilize the capability in the future to support their research, prototyping programs, and product fabrication. Highlights include:• Inside NGMM: Early customer/partner engagement, program timeline, and ways to get involved in three-dimensional multi-material, heterogeneously integrated (3DHI) research and development (R&D) and prototyping.• Technology roadmap: Overview of 3DHI technology roadmap and design/development infrastructure.• Progress in action: Hear the latest on facility, infrastructure, equipment, and key milestones in process development.This in-person meeting will be held on October 27-28, 2025, at The University of Texas at Austin-s AT&T Hotel and Conference Center from 8:30 a.m. to 5:00 p.m. CT on October 27, and from 8:30 a.m. to 1:30 p.m. CT on October 28, 2025.The NGMM Summit will include overview presentations by government, industry, and academic personnel. There will be time allotted for discussions and networking amongst the participants. All presentations and discussions will be held at the UNCLASSIFIED level. All attendees are required to present government-issued photo identification upon entry to the event.
  • Documents:

 Tender Notice

DARPA-SN-25-85.pdf

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Next-Generation Microelectronics Manufacturing (NGMM) Summit - USA Tender

The DEPT OF DEFENSE | DEFENSE ADVANCED RESEARCH PROJECTS AGENCY (DARPA), a Government sector organization in USA, has announced a new tender for Next-Generation Microelectronics Manufacturing (NGMM) Summit. This tender is published on USARFP under UST Ref No: 122685195 and is categorized as a Tender. Interested and eligible suppliers are invited to participate by reviewing the tender documents and submitting their bids before the deadline on 2025-10-06.

The estimated tender value is Refer Document, and full details, including technical specifications and submission requirements, are provided in the official tender documents. Ensure all submissions meet the criteria outlined to be considered for evaluation.

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