- Country: USA
- Summary: Notice of Intent to Noncompetitively Acquire CHIPS AFM Thermocouple SThM module
- UST Ref No: 119638036
- Deadline: 05 Jun 2025
- Financier: Self Financed
- Purchaser Ownership: Government
- Tender Value: Refer Document
- Notice Type: Tender
- Document Ref. No.: NB305000-25-01626
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- Description:
- Description
Notice of Intent to Noncompetitively Acquire CHIPS AFM Thermocouple SThM module
This notice is not a request for a quotation. A solicitation document will not be issued and quotations will not be requested.
This acquisition is being conducted under the authority of FAR 13.106-1(b). The North American Industry Classification System (NAICS) code for this acquisition is 334516
The National Institute of Standards and Technology (NIST) Material Measurement Laboratory (MML) is one of seven metrology laboratories within the National Institute of Standards and Technology (NIST). The laboratory supports the NIST mission by serving as the national reference laboratory for measurements in the material sciences to include the CHIPS Metrology Program. The Nanoscale Mechanical Properties Group requires the acquisition of an Atomic Force Microscopy (AFM) application module for Thermocouple Scanning Thermal Microscopy (SThM). This module, which provides direct measurement of local variations in temperature and thermal conductivity at the nanoscale, is essential to our CHIPS project focused on mapping nanoscale to microscale thermal mechanical properties of materials used in advanced packaging. This capability directly supports the third Grand Challenge of the CHIPS R&D Metrology Program to advance semiconductor manufacturing by enabling metrology for integrated components in advanced packaging. By providing a comprehensive and detail understanding of material properties, specifically how local variations in temperature affect or not the mechanical properties, this investment will provide needed predictive capabilities for material selection and enable innovation in advanced packaging, benefiting the semiconductor industry and quality of life through improved performance and product reliability.
NIST conducted market research in since November 2024 by internet research, GSA advantage searches, SAM.gov searches, speaking with colleagues/ other professi... - Documents:
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CLICK HERE TO LOGINNotice of Intent to Noncompetitively Acquire CHIPS AFM Thermocouple SThM module - USA Tender
The COMMERCE, DEPARTMENT OF | NATIONAL INSTITUTE OF STANDARDS AND TECHNOLOGY, a Government sector organization in USA, has announced a new tender for Notice of Intent to Noncompetitively Acquire CHIPS AFM Thermocouple SThM module. This tender is published on USARFP under UST Ref No: 119638036 and is categorized as a Tender. Interested and eligible suppliers are invited to participate by reviewing the tender documents and submitting their bids before the deadline on 2025-06-05.
The estimated tender value is Refer Document, and full details, including technical specifications and submission requirements, are provided in the official tender documents. Ensure all submissions meet the criteria outlined to be considered for evaluation.
