- Country: USA
- Summary: Notice of Intent to Sole Source for Silicon Wafers with Multiple Thin Films
- UST Ref No: 119167692
- Deadline: 28 May 2025
- Financier: Self Financed
- Purchaser Ownership: Government
- Tender Value: Refer Document
- Notice Type: Tender
- Document Ref. No.:
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- Description:
- Description
Notice of Intent to Noncompetitively acquire Semiconductor Wafers with Multiple Thin Films.
This notice is not a request for a quotation. A solicitation document will not be issued, and quotations will not be requested.
This acquisition is being conducted under the authority of FAR 13.106-1(b). The North American Industry Classification System (NAICS) code for this acquisition is 334413, Semiconductor and Related Device Manufacturing which has a small business size standard of 1,250 employees.The semiconductor supply chain is global, specialized, and interconnected. Chipmakers do business with thousands of individual suppliers that provide the highly complex materials and tools used to produce semiconductors. To address the lack of full visibility into the semiconductors markets supply chain and R&D ecosystem gaps the National Institute of Standards and Technology (NIST) will conduct the measurement science, or metrology, critical to the development of new materials, packaging, and production methods in chip manufacturing.
With this goal, the NIST Biomedical Measurement Technologies Group within the Microsystems and Nanotechnology Division of the Physical Measurement Laboratory (PML) requires specialized test substrates composed of silicon wafers enhanced with multiple thin films. These substrates are a critical component of a CHIPS program to assess the functionalization of semiconductor substrates with passivation and biorecognition elements to advance measurements of manufacturable CMOS biosensors.
This project aims to rigorously assess the stability and reliability of biomolecule attachment to semiconductor surfaces, which is vital for the development of effective biosensors. The substrates required will serve as an industry reference point for NIST's internal samples. As such, they must be manufactured on high-quality foundry or research-grade semiconductor fabrication lines capable of processing 200 mm silicon wafers. The thin ... - Documents:
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CLICK HERE TO LOGINNotice of Intent to Sole Source for Silicon Wafers with Multiple Thin Films - USA Tender
The COMMERCE, DEPARTMENT OF | NATIONAL INSTITUTE OF STANDARDS AND TECHNOLOGY, a Government sector organization in USA, has announced a new tender for Notice of Intent to Sole Source for Silicon Wafers with Multiple Thin Films. This tender is published on USARFP under UST Ref No: 119167692 and is categorized as a Tender. Interested and eligible suppliers are invited to participate by reviewing the tender documents and submitting their bids before the deadline on 2025-05-28.
The estimated tender value is Refer Document, and full details, including technical specifications and submission requirements, are provided in the official tender documents. Ensure all submissions meet the criteria outlined to be considered for evaluation.
