- Country: USA
- Summary: NOTICE OF INTENT TO SOLE SOURCE: 300 mm Si wafer with Cu damascene patterns
- UST Ref No: 113238391
- Deadline: 29 Jan 2025
- Financier: Self Financed
- Purchaser Ownership: Government
- Tender Value: Refer Document
- Notice Type: Tender
- Document Ref. No.: NB305000-25-00513
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- Description:
- Description
The United States Department of Commerce (DOC), National Institute of Standards and Technology (NIST), Acquisition Management Division (AMD) intends to negotiate, on a sole source basis, with AMAG Consulting, LLC, 221 FEATHERWOOD COURT, SCHENECTADY, NY 12303 for the purchase of one (1) 300 mm Si wafer with Cu damascene patterns to be utilized by NIST-s Microsystems and Nanotechnology Division (MND). The statutory authority for this acquisition is 41 USC 3304(a)(1); FAR 13.106-1(b).
***** Sole source determination is based on the need to acquire a quantity of one (1) 300 mm Si wafer with Cu damascene patterns to advance the CHIPS mission of developing imaging and measurement solutions for integrated circuit (IC) overlay metrology using a scanning electron microscope (SEM).
Minimum Requirements:
Description: 300 mm Si wafer with Cu damascene patterns
Quantity: 1
For the SEM overlay metrology project, NIST requires a 300 mm Si wafer sample of a set of chips with Cu damascene patterns suitable for research and development efforts to evaluate the feasibility of physics-based simulations and AI-based modeling as the means to improve the performance of SEM-based overlay metrology. 193 nm lithography shall be used to create the overlay metrology patterns. It is also advantageous, but not required to place other than overlay dimensional metrology patterns on the chips. All chips across the wafer shall be made identical, naturally occurring small variations due to fabrication processes are permitted.
Specifically, the Contractor shall provide one wafer containing at least 12 chips with the following overlay metrology parameters:
1. Cu damascene patterns with box-in-box (BiB), image-based overlay (IBO), advanced imaging metrology (AIM) grating patterns, and Hitachi-type SEM-based overlay (SBO). Pattern design can be found in pertinent public literature.
2. Sets of varying size BiB, IBO, AIM and SBO overlay metrology ... - Documents:
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CLICK HERE TO LOGINNOTICE OF INTENT TO SOLE SOURCE: 300 mm Si wafer with Cu damascene patterns - USA Tender
The COMMERCE, DEPARTMENT OF | NATIONAL INSTITUTE OF STANDARDS AND TECHNOLOGY, a Government sector organization in USA, has announced a new tender for NOTICE OF INTENT TO SOLE SOURCE: 300 mm Si wafer with Cu damascene patterns. This tender is published on USARFP under UST Ref No: 113238391 and is categorized as a Tender. Interested and eligible suppliers are invited to participate by reviewing the tender documents and submitting their bids before the deadline on 2025-01-29.
The estimated tender value is Refer Document, and full details, including technical specifications and submission requirements, are provided in the official tender documents. Ensure all submissions meet the criteria outlined to be considered for evaluation.
