- Country: USA
- Summary: Photonic-Integrated Circuit (Pic) Component Fabrication for Astropic High-Contrast Imaging Request for Information (Rfi)
- UST Ref No: 97539284
- Deadline: 08 Mar 2024
- Financier: Self Financed
- Purchaser Ownership: Government
- Tender Value: Refer Document
- Notice Type: Tender
- Document Ref. No.: ASTROPIC-RFI-2024
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- Description:
- Description
The National Aeronautics and Space Administration (NASA) Ames Research Center (ARC) is hereby soliciting information from potential sources for requirements related to the photonic-integrated circuit (PIC) component fabrication for AstroPIC: Photonic Integrated Circuit High-Contrast Imaging.
PIC component fabrication: The successful contractor will be responsible for the component fabrication of a PIC with requirements set to enable a coronagraphic photonic nulling capability. This task includes fabrication of a PIC component at a commercial photonics foundry. PIC component inspection: Characterization of the photonic component to ensure the PIC component is properly post-processed, packaged, and verified for delivery on the printed circuit board (PCB). System performance testing: After manufacture of the photonic chip component, the system will undergo performance testing to demonstrate photonic nulling, throughput, bandwidth, and working angle separations.As part of this market research, we are seeking the following: (1) list of photonic integrated circuit wafer sizes, (2) substrates options (e.g., Silicon, Silicon Nitride, Lithium Niobate, Glass, etc.), (3) estimated time to component delivery after receiving design (i.e., foundry run-time), (4) estimated costs, and (5) access to foundry design kits to enable providing a photonic integrated circuit design.
NASA ARC is seeking capability statements from all interested parties, including all socioeconomic categories of Small Businesses and Historically Black Colleges and Universities (HBCU)/Minority Institutions (MI), and members of the underserved communities as defined by Executive Order 13985, Advancing Racial Equity And Support For Underserved Communities Through The Federal Government, for the purposes of determining the appropriate level of competition and/or small business subcontracting goals for component fabrication for AstroPIC: Photonic Integrated Circuit High-Contrast Imaging. ... - Documents:
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CLICK HERE TO LOGINPhotonic-Integrated Circuit (Pic) Component Fabrication for Astropic High-Contrast Imaging Request for Information (Rfi) - USA Tender
The NATIONAL AERONAUTICS AND SPACE ADMINISTRATION, a Government sector organization in USA, has announced a new tender for Photonic-Integrated Circuit (Pic) Component Fabrication for Astropic High-Contrast Imaging Request for Information (Rfi). This tender is published on USARFP under UST Ref No: 97539284 and is categorized as a Tender. Interested and eligible suppliers are invited to participate by reviewing the tender documents and submitting their bids before the deadline on 2024-03-08.
The estimated tender value is Refer Document, and full details, including technical specifications and submission requirements, are provided in the official tender documents. Ensure all submissions meet the criteria outlined to be considered for evaluation.
