Tender Details

Country: USA
Summary: Request for Information: Next Generation Microelectronics Manufacturing 3DHI Microsystems
UST Ref No: 123400303
Deadline: 29 Aug 2025
Financier: Self Financed
Purchaser Ownership: Government
Tender Value: Refer Document
Notice Type: Tender
Document Ref. No.: DARPA-SN-25-93
Purchaser's Detail:
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Description:
Description
The Defense Advanced Research Projects Agency (DARPA) Microsystems Technology Office (MTO) seeks information to support a future solicitation. This “Design Challenge” solicitation is intended to advance the next generation of 3D heterogeneously integrated (3DHI) microsystems by enabling early access to the capabilities established under the Next Generation Microelectronics Manufacturing (NGMM) program. The prototypes developed through this effort will demonstrate the unprecedented performance of 3DHI microelectronics. Through this RFI, DARPA aims to solicit further insight into the classes of 3DHI microsystems that can best leverage the NGMM integration technology roadmap to support innovative commercial and/or dual use applications.The goals of this Request for Information (RFI) include, but are not limited to: • Identification of innovative applications that can leverage 3DHI• Identification of organizations interested in utilizing NGMM-s 3DHI capability• Identification of potential barriers to fabricating 3DHI components• Identification of additional offerings that would further promote both the use of 3DHI and engagement with NGMM
Documents:

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Request for Information: Next Generation Microelectronics Manufacturing 3DHI Microsystems - USA Tender

The DEPT OF DEFENSE | DEFENSE ADVANCED RESEARCH PROJECTS AGENCY (DARPA), a Government sector organization in USA, has announced a new tender for Request for Information: Next Generation Microelectronics Manufacturing 3DHI Microsystems. This tender is published on USARFP under UST Ref No: 123400303 and is categorized as a Tender. Interested and eligible suppliers are invited to participate by reviewing the tender documents and submitting their bids before the deadline on 2025-08-29.

The estimated tender value is Refer Document, and full details, including technical specifications and submission requirements, are provided in the official tender documents. Ensure all submissions meet the criteria outlined to be considered for evaluation.