- Country: USA
- Summary: Sensor Open Systems Architecture (SOSA) S3C & HPSC Turn-Key Product Development System
- UST Ref No: 109699736
- Deadline: 31 Jan 2025
- Financier: Self Financed
- Purchaser Ownership: Government
- Tender Value: Refer Document
- Notice Type: Tender
- Document Ref. No.: GO-2672-10292004
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- Description:
- Description
The California Institute of Technology-s (Caltech-s) Jet Propulsion Laboratory (JPL), located at 4800 Oak Grove Drive, Pasadena, CA 91109, is issuing the subject RFI to obtain information to assess current industry manufacturing and technical capabilities and receive ROM cost and schedule estimates supporting the development of various SOSA S3C & HPSC based turn-key products.
Glossary
PIC = Plug-In Card CFE/CFS = Core Flight Executive / Core Flight Software SOSA = Sensor Open System Architecture S3C = SOSA Space Sub Committee F- = F prime JPL Open-source flight software framework SBC = Single Board Computer PSC = Power Supply CardPurpose
NASA is seeking to spur the development of an industry wide ecosystem of standardized interoperable cards that can be used to implement complete spacecraft avionics systems based on the SOSA™ S3C profiles. To guarantee interoperability the SOSA™ Space Subcommittee, comprising members from NASA, USSF and industry, have been working on a spacecraft avionics standard derived from the VITA 78 (Space VPX) specification. Initial elements of the standard are documented in the recently released SOSA Standard Snapshot 3(see SOSA Space Appendix), which has garnered broad industry support. The purpose of this RFI is to gather information which could eventually lead to a JPL RFP soliciting the development of one or more S3C SpaceVPX compliant development kit(s) for both commercial industry and government organizations. To this end, information is requested related to integrated development kits, as well as constituent products that can be included in a development kit (i.e. PICs, PSCs, software). NASA is proposing SBCs in this development kit be based on the High-Performance Spaceflight Computing (HPSC) processor, currently in development with Microchip Technology Inc. in a partnership with NASA and JPL, using the SOSATM S3C SBC Slot Profile.
Overview
The development kit is part of a broader NASA effort to a... - Documents:
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CLICK HERE TO LOGINSensor Open Systems Architecture (SOSA) S3C & HPSC Turn-Key Product Development System - USA Tender
The NATIONAL AERONAUTICS AND SPACE ADMINISTRATION, a Government sector organization in USA, has announced a new tender for Sensor Open Systems Architecture (SOSA) S3C & HPSC Turn-Key Product Development System. This tender is published on USARFP under UST Ref No: 109699736 and is categorized as a Tender. Interested and eligible suppliers are invited to participate by reviewing the tender documents and submitting their bids before the deadline on 2025-01-31.
The estimated tender value is Refer Document, and full details, including technical specifications and submission requirements, are provided in the official tender documents. Ensure all submissions meet the criteria outlined to be considered for evaluation.
