- Country: USA
- Summary: Sources Sought Notice for Copper See-through Wafer for SEM-based Overlay Metrology
- UST Ref No: 112249600
- Deadline: 08 Jan 2025
- Financier: Self Financed
- Purchaser Ownership: Government
- Tender Value: Refer Document
- Notice Type: Tender
- Document Ref. No.: NIST-SS25-CHIPS-0042
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- Description:
- Description
The purpose of this sources sought notice is to conduct market research and identify potential sources of commercial products/services that satisfy the Government-s anticipated needs.
BACKGROUND
The National Institute of Standards and Technology (NIST), Physical Measurement Laboratory (PML), Microsystems and Nanotechnology Division (MND), CHIPS R&D Program (https://www.nist.gov/chips/metrology-community) as part of the CHIPS Act activities, is now developing imaging and measurement solutions for integrated circuit (IC) overlay metrology using a scanning electron microscope (SEM). IC production relies on measurements of the 3D size, shape, and placement of structures with atomic-level precision and repeatability. The project will create a sound scientific foundation and comprehensive solutions for SEM-based overlay and dimensional metrology superior to currently used arbitrary methods. This will allow the design of overlay patterns, acquisition, and image analysis to be optimized entirely through artificial intelligence, physics-based simulation, and modeling and meet IC production requirements now and in the future.
NIST MND requires a wafer relevant to current IC technologies suitable for the SEM overlay measurements of Cu lines that can be covered with various Si oxide layers. Although this sample only approximates the complete overlay structure, it can be used to assess the advantage of using the physics of signal generation over simplistic methods that are not based on a physics model. The wafer containing many full-size chips will be diced into individual chips that will be covered by various thickness Si oxide layers at NIST NanoFab. The process will create a set of see-through overlay metrology samples needed for the SEM overlay metrology project.
NIST is seeking information from sources that may be capable of providing a commercial solution that will achieve the objectives described above, in addition to t... - Documents:
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CLICK HERE TO LOGINSources Sought Notice for Copper See-through Wafer for SEM-based Overlay Metrology - USA Tender
The COMMERCE, DEPARTMENT OF | NATIONAL INSTITUTE OF STANDARDS AND TECHNOLOGY, a Government sector organization in USA, has announced a new tender for Sources Sought Notice for Copper See-through Wafer for SEM-based Overlay Metrology. This tender is published on USARFP under UST Ref No: 112249600 and is categorized as a Tender. Interested and eligible suppliers are invited to participate by reviewing the tender documents and submitting their bids before the deadline on 2025-01-08.
The estimated tender value is Refer Document, and full details, including technical specifications and submission requirements, are provided in the official tender documents. Ensure all submissions meet the criteria outlined to be considered for evaluation.
