- Country: USA
- Summary: Sources Sought Notice for High-Speed, Distributable Monte Carlo Simulation for SEM-based Overlay Metrology
- UST Ref No: 114816914
- Deadline: 28 Feb 2025
- Financier: Self Financed
- Purchaser Ownership: Government
- Tender Value: Refer Document
- Notice Type: Tender
- Document Ref. No.: NIST-SS25-CHIPS-0066
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- Description:
- Description
The NIST Physical Measurement Laboratory (PML), Microsystems and Nanotechnology Division (MND), CHIPS R&D Program (https://www.nist.gov/chips/metrology-community) as part of the CHIPS Act activities (Grand Challenge 5: Modeling and Simulating Semiconductor Manufacturing Processes), is now developing imaging and measurement solutions for integrated circuit (IC) overlay metrology using a scanning electron microscope (SEM). IC production relies on measurements of the 3D size, shape, and placement of structures with atomic-level precision and repeatability. The project, titled “SEM Overlay Metrology Based on Physics Model and Artificial Intelligence,” will create a sound scientific foundation and comprehensive solutions for SEM-based overlay and dimensional metrology superior to currently used arbitrary methods. This will allow the design of overlay patterns, acquisition, and image analysis to be optimized entirely through artificial intelligence, physics-based simulation, and modeling and meet IC production requirements now and in the future. For this work, samples that contain patterns used for overlay measurements and relevant to current IC technologies are indispensable.
NIST is seeking information from sources that may be capable of providing a commercial solution that will achieve the objectives described above, in addition to the following essential requirements:
NIST MND requires high-speed, distributable Monte Carlo software (MC SW) suitable for SEM-based measurements of IC overlay structures by accurately simulating and modeling the electron-solid interactions and generating images for artificial (AI) metrology solutions. For this, high-speed generation of secondary and backscattered images using the physics of signal generation is indispensable. The MC SW must be implemented in the NIST CPU Cluster.
Sophisticated, 3D sample geometry, material definition, and visualization by graphical user interface Many shape pri... - Documents:
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CLICK HERE TO LOGINSources Sought Notice for High-Speed, Distributable Monte Carlo Simulation for SEM-based Overlay Metrology - USA Tender
The COMMERCE, DEPARTMENT OF | NATIONAL INSTITUTE OF STANDARDS AND TECHNOLOGY, a Government sector organization in USA, has announced a new tender for Sources Sought Notice for High-Speed, Distributable Monte Carlo Simulation for SEM-based Overlay Metrology. This tender is published on USARFP under UST Ref No: 114816914 and is categorized as a Tender. Interested and eligible suppliers are invited to participate by reviewing the tender documents and submitting their bids before the deadline on 2025-02-28.
The estimated tender value is Refer Document, and full details, including technical specifications and submission requirements, are provided in the official tender documents. Ensure all submissions meet the criteria outlined to be considered for evaluation.
