- Country: USA
- Summary: Sources Sought Notice for Standard Laboratory Oven
- UST Ref No: 114026693
- Deadline: 13 Feb 2025
- Financier: Self Financed
- Purchaser Ownership: Government
- Tender Value: Refer Document
- Notice Type: Tender
- Document Ref. No.: NIST-FY25-CHIPS-0055
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- Description:
- Description
The purpose of this sources sought notice is to conduct market research and identify potential sources of commercial products/services that satisfy the Government-s anticipated needs.
BACKGROUND
The National Institute of Standards and Technology (NIST), Gaithersburg 731.07 Group within the Engineering Laboratory is seeking a Laboratory Oven capable to perform accelerated aging experiments as part of a study of long-term reliability of materials used in advanced packaging of semiconductor chips. This work is in support of the CHIPS Metrology program.
The CHIPS Metrology program develops and advances cutting edge metrology capabilities for members of the US semiconductor manufacturing ecosystem. This NIST conducted research program works with device manufacturers, tool vendors, materials suppliers, and other organizations to address critical metrology gaps to spur innovation within seven grand challenge areas. For more information on CHIPS Metrology, please visit https://www.nist.gov/chips/research-development-programs/metrology-program
NIST is seeking information from sources that may be capable of providing a solution that will achieve the objectives described above, in addition to the following essential requirements:
Sample Types and Sizes Samples will include films, multilayered film structures, and sectioned wafers Materials to be aged will include polymeric components in advanced packaging, including underfill and encapsulation epoxies, fiber reinforced polymer substrates, along with thermal interface materials, filler components, treated substrates. These materials may be standalone films, combined into multilayered composites, or combined into assembled semiconductor structures as part of a fabricated test vehicle. Largest sample size is expected to be a sectioned 300 mm wafer. Thermal Range Oven must provide temperature up to at least 300 °C. Thermocouple must be included. Provide the number of thermocouples, their locatio... - Documents:
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CLICK HERE TO LOGINSources Sought Notice for Standard Laboratory Oven - USA Tender
The COMMERCE, DEPARTMENT OF | NATIONAL INSTITUTE OF STANDARDS AND TECHNOLOGY, a Government sector organization in USA, has announced a new tender for Sources Sought Notice for Standard Laboratory Oven. This tender is published on USARFP under UST Ref No: 114026693 and is categorized as a Tender. Interested and eligible suppliers are invited to participate by reviewing the tender documents and submitting their bids before the deadline on 2025-02-13.
The estimated tender value is Refer Document, and full details, including technical specifications and submission requirements, are provided in the official tender documents. Ensure all submissions meet the criteria outlined to be considered for evaluation.
