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Tech Licensing Opportunity: Advanced Bonding Method for Heterogeneous Systems

USARFP notice for Tech Licensing Opportunity: Advanced Bonding Method for Heterogeneous Systems. The reference ID of the tender is 103565716 and it is closing on 01 Jul 2025.

Tender Details

  • Country: USA
  • Summary: Tech Licensing Opportunity: Advanced Bonding Method for Heterogeneous Systems
  • UST Ref No: 103565716
  • Deadline: 01 Jul 2025
  • Financier: Self Financed
  • Purchaser Ownership: Government
  • Tender Value: Refer Document
  • Notice Type: Tender
  • Document Ref. No.: BA-1444
  • Purchaser's Detail:
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  • Description:
  • Description
    Advanced Bonding Method for Heterogeneous Systems
    An advanced method for seamlessly bonding similar and dissimilar materials, maintaining grain structure to minimize disruptions at the bond interface and enhancing material properties and integrity.
    The Challenge:
    In the high-stakes realms of aerospace, electronics, and nuclear industries, the integrity of material bonds can mean the difference between success and catastrophic failure. Traditionally, bonding similar and dissimilar materials often involves using interlayers or powders, which unfortunately creates visible bond lines that can become points of weakness. Researchers at INL have pioneered a groundbreaking method to achieve bonding of dissimilar materials through a multi-stage sintering process.
    How it Works:
    This innovative bonding method is much less energy intensive relative to other diffusion welding type technologies. The process also eliminates the need for additional interface materials to achieve material bonding. It removes the weaknesses associated with visible bond lines, providing a stronger, more reliable bond for a range of materials including ceramics, metals, and various combinations. The method has been demonstrated using Electric Field Assisted Sintering (EFAS) technologies, but it is adaptable for use with multiple sintering technologies, offering flexibility across different manufacturing contexts.
    Key Advantages:
    Enhanced Durability: Bonding without visible bond lines significantly reduces potential failure points, resulting in stronger and more reliable materials. Energy Efficiency: When coupled with Electric Field Assisted Sintering, the method reduces processing time by an order of magnitude vs. hot press, providing an eco-friendly alternative to traditional methods Versatility: The technology is applicable not only in EFAS furnaces but can also be adapted for hot press, hot isostatic press, and conventional box or tube furnaces. No Additi...
  • Documents:

 Tender Notice

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Tech Licensing Opportunity: Advanced Bonding Method for Heterogeneous Systems - USA Tender

The ENERGY, DEPARTMENT OF, a Government sector organization in USA, has announced a new tender for Tech Licensing Opportunity: Advanced Bonding Method for Heterogeneous Systems. This tender is published on USARFP under UST Ref No: 103565716 and is categorized as a Tender. Interested and eligible suppliers are invited to participate by reviewing the tender documents and submitting their bids before the deadline on 2025-07-01.

The estimated tender value is Refer Document, and full details, including technical specifications and submission requirements, are provided in the official tender documents. Ensure all submissions meet the criteria outlined to be considered for evaluation.

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